We are excited to announce that the 6th International ECCC Conference – Creep & Fracture in High Temperature Components, Design & Life Assessment, known as “ECCC2023”, is being run as a physical Conference, taking place in Edinburgh during 22-24th of May, 2023. Our partners, the Events Team at IoM3 will help host the Conference, with further detailed information soon to be given regarding registration etc.
We wish to thank the authors of the papers already submitted, especially those who transferred their papers from the ECCC2020 conference. We now seek further abstracts for papers, that can be submitted at the links below.
- On Day 1, 22 May, Plenary and Keynote papers will be presented live
- On Day 2/3, 23 and 24th May, sessions will take place with papers presented live
As with all our conferences, ECCC2023 will bring together engineers and scientists from around the world to present and discuss research and developments in all aspects of creep behaviour of high temperature industrial materials and components. The overall aim is to disseminate knowledge and identify future work items requiring attention from the high temperature research, design and standardisation communities.
Registration, Programme, Event information etc: (Please see flyer for now)
Abstracts may be submitted to the email address: email@example.com, with further information on our Abstracts and Papers Submission page
Please also download further details by visiting our Flyer page.
We look forward to welcoming you to Edinburgh!
Looking for the ECCC2021 Conference? The content and proceedings can be accessed as follows:
General information: ECCC, ECCC2021 and other conference proceedings via our main ECCC website at eccc-creep.com
For ECCC2021 attendees: background information at https://www.iom3.org/events-awards/eccc2021.html. Access to presentations, video content etc via your existing login sent by email.